Open for offers

Deposition Tool 8 Inch

Deadline:05 Oct 2026, 00:00 CEST

Tender information

TED EU

Garching, Germany

Type: 16
Procedure: open
Ref. number: 579224-2026
CPV: 38000000

The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has…

to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of

the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).

Deposition Tool 8 Inch

Tender information

Documents