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Silicon deep reactive ion etcher (Si DRIE)

Frist:26 Sept 2025

Ausschreibungsinformationen

TED EU

Kgs. Lyngby, Denmark

Art
16
Verfahren
open
Referenznummer
562633-2025
CPV
38000000

DTU Nanolab requires a silicon deep reactive ion etcher (Si DRIE) to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q4 2026. The Instrument will be installed in the DTU

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