The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork

lution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities

for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system