Silicon Austria Labs – Chips JU: Wafer bumper & reflow
Ausschreibungsinformationen
TED EUGraz, Austria
- Art
- 29
- Verfahren
- neg-w-call
- Referenznummer
- 554740-2025
- CPV
- 38000000
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping and re…