Semi-Automatic Wafer Grinder

s of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroo

m equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents.