JPA2025ID94 - 1Normal waferprobing

in (a few hundred) to millimetre-thick samples or wafers of 200 mm and 300 mm diameter and for probing dies on wafer frames (for 300 mm wafers on dicing frames).

In combination with measuring instruments, Auto (Frame) Probers are used for parametric testing of individual integrated circuits at wafer or sample level. The device should be suitable at least for testing micrometer-th