200 mm Wafer Prober incl. Temperature Testing - PR874550
Frist:06 Mar 2025, 00:00 CET
Ausschreibungsinformationen
TED EUMünchen, Germany
- Art
- 16
- Verfahren
- open
- Referenznummer
- 98618-2025
- CPV
- 38552000
1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 30…