Deep Reactive Ion Etching (DRIE) Si fluorine chemistry etcher

nt is procured through the MagKI investment programme which will provide advanced substrate structuring capabilites to the cleanroom which will be used in the final production of magnetic nanodevices for next-gen European based Artifical Intelligence. It will also offer near vertical sidewall profil

e of etched via's in Si, SiC as well as 2D materials, like graphene and MoS2. Beside the fulfilment of the criteria described under 2. Performance quote of this Annex A, the scope of deliveries and services includes and are part of the of