Waferbond_Anlage - PR478860-2660-W
Ausschreibungsinformationen
DE_BKMSMünchen, Germany
- Art
- goods (award)
- Verfahren
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Referenznummer
- ea99f8fe-1120-4f9d-ab48-61804da5412c
- CPV
- 42641000
Waferbond_Anlage