Fully Automatic Wafer-to Wafer Bonder - PR408678-3460-W
Ausschreibungsinformationen
DE_BKMSMünchen, Germany
- Art
- goods (tender)
- Verfahren
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Referenznummer
- 009ce642-c931-4ab4-a826-13358893c5cb
- CPV
- 42990000
Fully Automatic Wafer-to Wafer Bonder