Wafer Bonder-Aligner
Tender information
TED EUSTOCKHOLM, Sweden
- Type
- 29
- Procedure
- open
- Ref. number
- 40016-2026
- Estimated value
- 1,140,000 EUR
- CPV
- 33000000
KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), an…