Low temperatur ICB wafer bonder (ISIT03.1) - PR879696-2390-P
Tender information
TED EUMünchen, Germany
- Type
- 29
- Procedure
- neg-wo-call
- Ref. number
- 197865-2025
- Estimated value
- 0 EUR
- CPV
- 42990000
Low temperatur ICB wafer bonder
München, Germany
Low temperatur ICB wafer bonder