200 mm wafer coating and developing track tool DUV

into a DUV exposure tool, but also capable of developing wafers from the i-line stepper in the same facility. The tool features open cassette loading stations, spin coating and developing stations and hot and cool plates, and a module for integration with the DUV exposure tool. The tool also should

have an option of extracting processed wafers in open cassettes. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by DUV stepper or other exposur