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Silicon deep reactive ion etcher (Si DRIE)

Tender information

TED EU

Kgs. Lyngby, Denmark

Type
29
Procedure
open
Ref. number
542204-2025
CPV
38000000

DTU Nanolab requires a silicon deep reactive ion etcher (Si DRIE) to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q4 2026. The Instrument will be installed in the DTU

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