One-step procedure

and micro- and nanosystems. The dicing saw enables high-precision cutting of hard and brittle materials such as semiconductors, glass and ceramics into defined shapes and sizes - a critical step in device fabrication and materials characterization.

A dicing saw is to be acquired for the cleanroom facility at the Department of Materials Science and Engineering, Myfab Uppsala, to support ongoing and future research in materials science, electronics, bionanotechnology