Silicon Austria Labs – Chips JU: Wafer bumper
Tender information
TED EUGraz, Austria
- Type
- 29
- Procedure
- neg-w-call
- Ref. number
- 378296-2026
- Estimated value
- 1,260,320 EUR
- CPV
- 38000000
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool a…