Ion beam trimmer

maximum within 3-15 mm. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents.

The object of the tender is 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half