A 300mm wafer compatible, multi-chamber PVD platform designed for high throughput of magnetic tunnel junctions. Additionally, the following PVD and process chamber designs that must be supported are: 1) Multi-cathode PVD…
chamber 2) a pre-clean chamber to remove native oxides and other contaminants, 3) degass/annealing capability and, 4) a cryogenic stage (<100K) option in, or ex, situ of the PVD modules. Furthermore, the platform must be compatible with Front Opening Universal Pods with a 25-slot capacity, includin
g an Equipment Front End Module and load-lock system for wafer loading. Finally, the deposition must be computer controlled and automated following defined recipes. As an optional, the platform should be compatible with automatic recipe upl