Conformal sputtering tool for versatile deposition of thin films with high aspect ratio, dielectrics and piezoelectrics, advanced metal alloys, and multilayer stacks
Tender information
TED EUVTT, Finland
- Type
- 25
- Procedure
- neg-wo-call
- Ref. number
- 737636-2025
- CPV
- 38500000
THE SUBJECT OF THE PROCUREMENT The subject of the procurement is a modular and versatile cluster sputtering tool for the deposition of conformal thin films with high aspect ratios. Beside the two conformal sputtering mod…