System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Tender information
TED EUMünchen, Germany
- Type
- 16
- Procedure
- neg-w-call
- Ref. number
- 498425-2026
- CPV
- 42990000
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1)