LA2972C- UCC- RFT for the Supply of a High Aspect Ratio Etcher

advanced heterogeneous of semiconductor devices. We invite proposals for an advanced etching system capable of performing high aspect ratio silicon (Si) etching using the Bosch process. This equipment will be essential for etching deep Si trenches, facilitating the creation of through silicon vias

(TSVs) that are critical for heterogeneous integration. The ideal tool will offer precision, reliability, and efficiency to meet the requirements for the etching of both 100mm and 200mm wafers. Vendors with cutting-edge solutions that can a