Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Deadline:24 Jul 2026, 00:00 CEST
Tender information
TED EUMünchen, Germany
- Type
- 16
- Procedure
- open
- Ref. number
- 434171-2026
- CPV
- 42990000
Die-to-Wafer Bonder (IPMS-MRS14.1)
München, Germany
Die-to-Wafer Bonder (IPMS-MRS14.1)