- Type
- 29
- Procedure
- open
- Ref. number
- 751516-2024
- Estimated value
- 195,219 EUR
- CPV
- 38000000
THE OBJECT OF THE TENDER PROCESS The object of the tender process is a Stylus Profilometer for both 200 mm- and 300 mm wafers. The equipment will be used in VTT's microelectronics cleanroom located in Tekniikantie 17 Esp…
oo Finland (VTT's Micronova center for applied micro and nanotechnology). For further information, see https://www.vttresearch.com/en. The tool must be capable of measuring 200- and 300 mm single side polished (SSP), double side polished (DSP)- and SOI silicon wafers as well as glass and fused silic
a wafers. The technical specification of the object of the tender is described in more detail in Annex 1 of this invitation to tender. The equipment must comply with all technical properties and functionalities, performance specifications