Wafer metrology
Deadline:29 May 2026
Tender information
TED EUEspoo, Finland
- Type
- 16
- Procedure
- open
- Ref. number
- 290369-2026
- CPV
- 38000000
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric f…