THE OBJECT OF THE PROCUREMENT The procurement concerns the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconduct…
or wafers. The scope includes the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool is acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive components b. CMOS wa
fers Back-End-of-the-Line (BEOL) and Mid-End-of-the-Line (MEOL) c. Hybrid bonding d. Above structures may include also low K materials which need special cleaning methods 2. Through-silicon via (TSV) a. overburden metallization removal b. S