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200 mm Wafer Prober incl. Temperature Testing - PR874550

Tender information

TED EU

München, Germany

Type
29
Procedure
open
Ref. number
454600-2025
CPV
38552000

1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 30

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