200 mm Wafer Prober incl. Temperature Testing - PR874550
Tender information
TED EUMünchen, Germany
- Type
- 29
- Procedure
- open
- Ref. number
- 454600-2025
- CPV
- 38552000
1 piece. This specification describes the requirements for a wafer probing system to be used for characterization and test engineering for sensor ICs at the Fraunhofer IIS. The system must allow handling of 200 mm and 30…