200 mm coating and developing track tool

nvolves a single cassette-to cassette tool with spin coating and developing stations and hot and cool plates. The coating and developing track tool is intended to support silicon semiconductor front end processing of 200 mm wafers, facilitating exposure by stepper or automated mask aligner. The tech

nical specification of the object of the tender is described in more detail in this Annex 1 of the invitation to tender. The Tool must comply with all technical properties and functionalities, performance specifications and acceptance crite