High accuracy Flip-Chip Bonder - PR463284-2270-W
Deadline:01 Mar 2024, 00:00 CET
Tender information
TED EUMünchen, Germany
- Type
- 16
- Procedure
- open
- Ref. number
- 71360-2024
- CPV
- 42990000
High accuracy Flip-Chip Bonder
München, Germany
High accuracy Flip-Chip Bonder