We are looking for a 300mm wafer ultra-high resolution focused ion beam scanning electron microscope (FIB-SEM) system. The tool should allow for nanometer scale imaging of a cross-section and preparation of precise locat…
ed and thin TEM lamellae. End-pointing of the cross section as well as location for the TEM lamella needs to be precise within nanometer range on a specific structure. Final achieved thickness of TEM lamella Is required below 30nm to provide minimal overlap within lamella thickness, while still bein
g crystalline and uncontaminated, ready for TEM inspection. The tool needs to be able to load 300mm wafers and have a possibility to load multiple TEM grids on the stage. Grid position needs to allow for lamella preparation in multiple orie