Chip to Wafer Bonder
Deadline:20 Feb 2024, 00:00 CET
Tender information
TED EUFrankfurt (Oder), Germany
- Type
- 16
- Procedure
- open
- Ref. number
- 40215-2024
- CPV
- 38000000
Dyson V15s Detect SubmarineTM Nass- und Trockensauger
Frankfurt (Oder), Germany
Dyson V15s Detect SubmarineTM Nass- und Trockensauger