Los 1: High Accuracy Flip Chip Bonder low force
Tender information
TED EUMünchen, Germany
- Type
- 29
- Procedure
- open
- Ref. number
- 443294-2025
- CPV
- 31712100
High Precision bonder for wafer and chiplet level assembly (IZM-01)
München, Germany
High Precision bonder for wafer and chiplet level assembly (IZM-01)