Wafer Bonder-Aligner
Deadline:27 Oct 2025
Tender information
TED EUSTOCKHOLM, Sweden
- Type
- 16
- Procedure
- open
- Ref. number
- 584891-2025
- Estimated value
- 10,000,000 SEK
- CPV
- 33000000
KTH need this system for Aligned semiconductor wafer bonding, which is a manufacturing process that is critical for future nanoelectronics, photonics, microwave systems, sensors, microelectromechanical systems (MEMS), an…