1. Pick and Place equipment upgrade: • Wafer Holder • Die Eject Module • Flip Chip Module

as ‘Specifications’). The equipment listed in Schedule V are the lots that the tender comprises. Tenderers may bid for one or more lots. The subject matter of the contract, in all cases, does not include so-called refurbished scientific instruments and equipment. The single lot comprising the tende

r is as follows: 1. Pick and Place equipment upgrade: • Wafer Holder • Die Eject Module • Flip Chip Module The project is funded by ANI - Agencia Nacional de Inovação under the Joint Procurement Agreement signed between INL and Chips JU.