JPA2025ID34 - 1

spection Tool. This tool is used to automatically detect nanometer-sized defects and pattern deviations on 300mm wafers as part of advanced CMOS process development and process monitoring. Such fast and highly accurate inspection of defects on wafers, for example after lithography, etching or materi

al deposition steps, therefore plays a crucial role in the development of the next generation of transistors and chips for processor and memory applications, as well as in optimizing the yield per wafer.