- Type
- 29
- Procedure
- neg-w-call
- Ref. number
- 724373-2024
- Estimated value
- 1,640,000 EUR
- CPV
- 38000000
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinaft…
er referred to as: “the Tool”). The tool is designed to be able to singulate wafers by means of a laser-based technique and to edge trim by applying circular cuts. The wafers to be processed consist of copper, LowK or other metal or dielectic films.
The object is the supply and commissioning of equipment for the research and development of industrial scalability of various nanotechnological applications, more specifically a wafer singulation (dicing) tool (hereinaft