Test head for Engineering - PR876507-2440-IIS-5.3

ization under different temperatures as well as test enginering and test for low-volume quantities (typically max. 50000 pc. per month). Therefore the need is not a need for high-through put, but flexibility and retrofitability afterwards regarding sensor stimulation setups.

This specification describes the requirements for an Pick-and-Place-Test handler for characterziation and test engineering for packaged sensor ICs at the Fraunhofer IIS. Focus will be the optical and magnetical character