The object of the tender process was Single wafer plasma asher tool (later also “Equipment”). The procurement object was a new 200 mm Single Wafer Plasma asher tool for the VTT Micronova cleanroom semiconductor front end…
. The procurement included a process chamber for Polymer Removal and PR ash. The single-wafer plasma asher tool was for silicon semiconductor front-end, the tool had to be compatible with industry-standard cleanroom requirements, including automated wafer handling, welded gas lines with VCR-gasket c
onstruction, particle filters, etc., and CE-compliant, with Emergency shutdown, capable processing of 200 mm including the following processes: Polymer removal PR ash (bulk strip, HDIS, Descums) The Single wafer asher tool will be used in s