Market survey: Stylus profilometer for 200/300 mm wafers for VTT Micronova cleanroom

(Micronova center for applied micro and nanotechnology | VTT (vttresearch.com)).   With this market survey, VTT is searching for potential suppliers and equipment available to get additional information on suppliers capable of delivering the equipment described in this information request.    Key f

eatures:  The tool must be capable of measuring 200- and 300 mm single side polished (SSP), double side polished (DSP)- and SOI silicon wafers as well as glass and fused silica wafers.  Manual wafer loading and unloading requested.  Tool mu