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Clustertool for Ion Beam Etching of 300mm wafers

Tender information

TED EU

Erlangen, Germany

Type
16
Procedure
neg-w-call
Ref. number
117594-2026
CPV
42900000

The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class

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