Thin Film Cluster Deposition System for Sputtering of Metals and Dielectrics
Tender information
TED EUZürich, Switzerland
- Type
- 29
- Procedure
- open
- Ref. number
- 771659-2025
- Estimated value
- 2,870,055 CHF
- CPV
- 38000000
Thin-film cluster coating system for sputtering metals and dielectrics Cluster system with an airlock and 4 process chambers (PCs) for DC and RF sputtering of dielectrics and metals on semiconductors and other substrates…