- Type
- 16
- Procedure
- open
- Ref. number
- 311521-2024
- Estimated value
- 1,050,000 EUR
- CPV
- 38000000
The MESA+ Institute will invest in a new Dry Etch tool system to reinforce their state-of-the-art etch capabilities and etch capacity. Applications: The tool must be capable of etching silicon and/or silicon-based materi…
als for a variety of nano- and/or microscale structures with nanometre precision and high wafer-scale uniformity. The tool must be suitable for the etching of silicon-based materials with etch rates of 1 nm/min up to 15 µm/min. The tool must be equipped with reliable end-pointing, also for loadings
of < 5% open area (based on 100 mm wafer), using OES or laser interferometry. The required nanometric precision of the tool is defined as the wafer-scale controllability in three-dimensional micro- and nano-machining of silicon and/or sili