Multichip Module Package for SiC Pressure Sensors
Deadline:30 Jun 2026, 08:00 GMT-4
Tender information
SAM.govSTENNIS SPACE CENTER, United States
- Type
- Combined Synopsis/Solicitation
- Procedure
- Combined Synopsis/Solicitation
- Ref. number
- be8e1f1156144652a73c065ffad6e328
- NAICS
- 334419