Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Deadline:24 Jul 2026, 10:00 CEST
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (tender)
- Procedure
- Open
- Ref. number
- 665210c7-5fa7-480f-b51e-a2dedff0fd0b
- CPV
- 42990000
Die-to-Wafer Bonder (IPMS-MRS14.1)