Chip to Wafer Bonder
Deadline:20 Feb 2024, 12:00 CET
Tender information
DE_BKMSFrankfurt (Oder), Germany
- Type
- goods (tender)
- Procedure
- Open
- Ref. number
- 379ce051-7f18-4c5e-a5ef-94616e00d6ad
- CPV
- 38000000
Dyson V15s Detect SubmarineTM Nass- und Trockensauger