High Precision bonder for wafer and chiplet level assembly (IZM-01 - PR915599-2590-P
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Open
- Ref. number
- c9762314-ea5f-4fc0-892e-6262be27029b
- CPV
- 31712100
High Precision bonder for wafer and chiplet level assembly (IZM-01)