Clustertool for Ion Beam Etching of 300mm wafers
Tender information
DE_BKMSErlangen, Germany
- Type
- goods (award)
- Procedure
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Ref. number
- 8d5c5fcb-fad2-45ef-bc2f-90c6365fb076
- CPV
- 42900000
The tender item is an ion beam etching process tool to be used for 300mm wafer fabrication at the FRAUNHOFER IPMS. The systems will be used for the processing of CMOS wafers in a cleanroom class 1000 (approximately class…