Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (tender)
- Procedure
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Ref. number
- 2e71b8bd-9fed-4698-b342-f6ccb0836414
- CPV
- 31712100
Wafer Bonder for oxidfree bonding process