Handling systems for 3D wafer substrates (PVD, RIE, CMP, WET) - PR449116-3460-W
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Negotiated without prior call for competition
- Ref. number
- 5f621c68-83ba-4c9b-b922-ca933618a101
- CPV
- 39300000
Handling systems for 3D wafer substrates (PVD, RIE, CMP, WET)