Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Negotiated with prior publication of a call for competition / competitive with negotiation
- Ref. number
- eb3f9b94-6f35-49b7-9897-ba24888194bd
- CPV
- 31712100
Wafer Bonder for oxidfree bonding process