High accuracy Flip-Chip Bonder - PR463284-2270-W
Tender information
DE_BKMSMünchen, Germany
- Type
- goods (award)
- Procedure
- Open
- Ref. number
- 67f092c6-426d-4000-85c3-fe2e9f834bba
- CPV
- 42990000
High accuracy Flip-Chip Bonder
München, Germany
High accuracy Flip-Chip Bonder